Description

Cooler Master Thermal Pad 1.0mm

The Cooler Master Thermal Pad 1.0mm delivers powerful thermal conductivity in a convenient, clean format. Ideal for CPUs, GPUs, VRMs, RAM, and other critical components, it offers an easy and reusable solution for thermal management.

With a thermal conductivity of 13.3 W/mK, this pad transfers heat efficiently from components to heatsinks or cooling surfaces. Its 1.0mm thickness fills minor gaps or surface irregularities, ensuring maximum contact and performance. Unlike thermal paste, the pad requires no curing time and doesn’t create a mess.

Cooler Master uses a flexible, silicone-based material that adapts easily during installation. You can cut it to size for different hardware needs. Since it doesn’t conduct electricity, it adds a layer of safety when placed near sensitive parts.

The pad performs reliably in extreme environments, working in temperatures from -40°C to +200°C. You can use it in compact builds, gaming rigs, or workstations that demand stable cooling performance. Whether you’re building a new system or upgrading, the Cooler Master Thermal Pad provides long-term efficiency without frequent replacements.

Choose this solution when you want performance, convenience, and safety in one thermal interface.

Key Specifications:

• Thickness: 1.0mm

• Thermal Conductivity: 13.3 W/mK

• Operating Temperature Range: -40°C to +200°C

• Electrical Conductivity: Non-conductive

• Material: Silicone-based compound

• Applications: CPU, GPU, VRM, ICs, memory modules