Description

Cooler Master Thermal Pad 3.0mm

The Cooler Master Thermal Pad 3.0mm is designed to deliver superior thermal conductivity for high-performance devices. Whether you’re building a gaming PC, upgrading a workstation, or modifying electronics like consoles or laptops, this thermal pad ensures efficient heat transfer and stable operation.

With a thermal conductivity of 6.0 W/mK, it helps draw heat away from critical components such as GPUs, CPUs, VRMs, and RAM. Its 3.0mm thickness makes it ideal for components with larger gaps or uneven surfaces, where standard thermal pads may not provide sufficient contact.

Made from non-electrically conductive, silicone-based material, the Cooler Master Thermal Pad offers a safe and reliable solution. It minimizes the risk of short circuits and is also corrosion-resistant. The pad conforms easily to irregular shapes, ensuring consistent thermal performance.

Installation is easy—just cut the pad to your desired size and apply it between the component and heatsink. There’s no curing time or mess like traditional thermal paste, making it perfect for users who want clean, fast upgrades.

In summary, this thermal pad combines flexibility, safety, and high conductivity to improve your system’s cooling and overall performance.

Key Specifications:

• Thickness: 3.0mm

• Thermal Conductivity: 6.0 W/mK

• Material: Silicone-based with ceramic fillers

• Electrical Conductivity: Non-conductive

• Temperature Range: -40°C to 200°C

• Applications: CPU, GPU, VRM, RAM, laptops, gaming consoles