Description

ID-COOLING FROST X55

The ID-COOLING FROST X55 is a high-performance thermal paste designed to improve heat transfer between your processor and cooler. It fills microscopic gaps between the contact surfaces, allowing heat to move more efficiently. As a result, it helps your cooling system maintain effective thermal performance.

With 16.2 W/m-K thermal conductivity, FROST X55 is designed for performance-focused PC builds, gaming systems, and demanding workloads. In addition, its 0.02°C-cm²/W thermal resistance supports efficient heat transfer between the CPU and heatsink.

The thermal paste has a 120 Pa·s viscosity, providing a consistent compound texture for application. Moreover, its 2.9 g/cm³ density contributes to stable material properties during use.

FROST X55 is available in 2g and 4g quantities. Therefore, you can choose the amount that suits your PC build or future thermal paste replacement needs. It also operates across a wide temperature range of -50°C to 250°C.

Overall, the ID-COOLING FROST X55 is a strong choice for users looking for high thermal conductivity, low thermal resistance, and reliable heat transfer for their PC cooling setup.

Key Specifications

• Product Type: Thermal Paste
• Thermal Conductivity: 16.2 W/m-K
• Thermal Resistance: 0.02°C-cm²/W
• Net Weight: 2g / 4g
• Density: 2.9 g/cm³
• Viscosity: 120 Pa·s
• Operating Temperature: -50°C to 250°C
• Color: Grey